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Fully-filled, highly-reliable fine-pitch interposers with TSV aspect ratio >10 for future 3D-LSI/IC packaging
Murugesan Murugesan, Takafumi Fukushima, Kiyoharu Mori, Ai Nakamura, Yisang Lee, Makoto Motoyoshi, J. C. Bea, Shigeru Watariguchi, Mitsumasa Koyanagi
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
15
Citations
(Scopus)