@inproceedings{46d03e3b27eb44deb31c86dd1528c944,
title = "Fully-integrated, fully-differential 3-axis tactile sensor on platform LSI with TSV-based surface-mountable structure",
abstract = "The present paper reports a 2.8-mm-square surface-mountable MEMS-on-LSI integrated 3-axis tactile sensor for robot applications, which incorporates sensing and signal processing in a single chip. The MEMS part has a quad-seesaw-electrode structure for fully-differential capacitive 3-axis force sensing. The LSI is an original sensor platform LSI equipped with deep annular-type through silicon vias (TSVs). A multi-project LSI wafer was processed after fabrication in an LSI foundry. The MEMS part and the LSI part were integrated by Au-Au thermocompression bonding. The output is a digital packet and is transferred through the TSV and a bus line. A working test successfully demonstrated the fully-differential capacitive 3-axis force sensing of the fully-integrated tactile sensor.",
keywords = "3-axis force sensing, MEMS-on-LSI integration, Quad-seesaw-electrode structure, Sensor platform LSI, Tactile sensor, Through silicon via",
author = "Yoshiyuki Hata and Yukio Suzuki and Masanori Muroyama and Takahiro Nakayama and Yutaka Nonomura and Rakesh Chand and Hideki Hirano and Yoshiteru Omura and Motohiro Fujiyoshi and Shuji Tanaka",
note = "Funding Information: The present study was performed in part at the R&D Center of Excellence for Integrated Microsystems, Tohoku University under the Japan Science and Technology Agency (JST) program “Formation of Innovation Center for Fusion of Advanced Technologies”. Publisher Copyright: {\textcopyright} 2017 IEEE.; 19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 ; Conference date: 18-06-2017 Through 22-06-2017",
year = "2017",
month = jul,
day = "26",
doi = "10.1109/TRANSDUCERS.2017.7994095",
language = "English",
series = "TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "500--503",
booktitle = "TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems",
address = "United States",
}