TY - GEN
T1 - Glass reflow process and its applications
AU - Van Toan, Nguyen
AU - Sangu, Suguru
AU - Ono, Takahito
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/11/28
Y1 - 2016/11/28
N2 - This work presents the glass reflow process for microsystems. In this process, glass compounded silicon structures are achieved with the help of vacuum cavities under a high temperature. Three applications employing the glass reflow process, through-wafer interconnects, thermal isolation, and optical window, have been proposed and investigated.
AB - This work presents the glass reflow process for microsystems. In this process, glass compounded silicon structures are achieved with the help of vacuum cavities under a high temperature. Three applications employing the glass reflow process, through-wafer interconnects, thermal isolation, and optical window, have been proposed and investigated.
KW - Glass capillary optical window
KW - Glass reflow process
KW - thermal isolation
KW - through-wafer interconnects
UR - http://www.scopus.com/inward/record.url?scp=85007227230&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85007227230&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2016.7758246
DO - 10.1109/NEMS.2016.7758246
M3 - Conference contribution
AN - SCOPUS:85007227230
T3 - 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
SP - 260
EP - 264
BT - 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016
Y2 - 17 April 2016 through 20 April 2016
ER -