TY - JOUR
T1 - Grain-orientation induced work function variation in nanoscale metal-gate transistors - Part I
T2 - Modeling, analysis, and experimental validation
AU - Dadgour, Hamed F.
AU - Endo, Kazuhiko
AU - De, Vivek K.
AU - Banerjee, Kaustav
N1 - Funding Information:
Manuscript received February 9, 2010; revised June 23, 2010; accepted July 12, 2010. Date of current version September 22, 2010. This work was supported in part by a Grant from Intel Corporation and in part by the UC-MICRO Grant 08-72. The review of this paper was arranged by Editor H. S. Momose.
PY - 2010/10
Y1 - 2010/10
N2 - This paper highlights and experimentally verifies a new source of random threshold-voltage (Vth) fluctuation in emerging metal-gate transistors and proposes a statistical framework to investigate its device and circuit-level implications. The new source of variability, christened work-function (WF) variation (WFV), is caused by the dependence of metal WF on the orientation of its grains. The experimentally measured data reported in this paper confirm the existence of such variations in both planar and nonplanar high-k metal-gate transistors. As a result of WFV, the WFs of metal gates are statistical distributions instead of deterministic values. In this paper, the key parameters of such WF distributions are analytically modeled by identifying the physical dimensions of the devices and properties of materials used in the fabrication. It is shown that WFV can be modeled by a multinomial distribution where the key parameters of its probability distribution function can be calculated in terms of the aforementioned parameters. The analysis reveals that WFV will contribute a key source of Vth variability in emerging generations of metal-gate devices. Using the proposed framework, one can investigate the implications of WFV for process, device, and circuit design, which are discussed in Part II.
AB - This paper highlights and experimentally verifies a new source of random threshold-voltage (Vth) fluctuation in emerging metal-gate transistors and proposes a statistical framework to investigate its device and circuit-level implications. The new source of variability, christened work-function (WF) variation (WFV), is caused by the dependence of metal WF on the orientation of its grains. The experimentally measured data reported in this paper confirm the existence of such variations in both planar and nonplanar high-k metal-gate transistors. As a result of WFV, the WFs of metal gates are statistical distributions instead of deterministic values. In this paper, the key parameters of such WF distributions are analytically modeled by identifying the physical dimensions of the devices and properties of materials used in the fabrication. It is shown that WFV can be modeled by a multinomial distribution where the key parameters of its probability distribution function can be calculated in terms of the aforementioned parameters. The analysis reveals that WFV will contribute a key source of Vth variability in emerging generations of metal-gate devices. Using the proposed framework, one can investigate the implications of WFV for process, device, and circuit design, which are discussed in Part II.
KW - Grain orientation
KW - metal-gate devices
KW - random variations
KW - reliability
KW - subthreshold leakage
KW - threshold voltage
KW - VLSI design
KW - work-function (WF) variation (WFV)
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U2 - 10.1109/TED.2010.2063191
DO - 10.1109/TED.2010.2063191
M3 - Article
AN - SCOPUS:77957004258
SN - 0018-9383
VL - 57
SP - 2504
EP - 2514
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 10
M1 - 5575410
ER -