TY - GEN
T1 - Graphene nano-ribbon-base highly sensitive pressure sensor using area-arrayed pillar structure
AU - Wang, Zhi
AU - Suzuki, Ken
AU - Miura, Hideo
N1 - Funding Information:
This research activity has been supported partially by Japanese Grants-in-aid for Scientific Research, and Tohoku University. This research was supported partly by JSPS KAKENHI Grant Number JP16H0653 7.
Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/1
Y1 - 2017/7/1
N2 - A novel highly sensitive pressure sensor was proposed in this paper. It has high flexibility (wearable) and modularization fabrication ability (high productivity and low cost). The proposed sensor structure was combined with two sections: a stress-concentration section and a stress-detecting section. The stress-concentration section has been successfully developed using PDMS patterned and copied from SU-8 micro structure, and the quality of the section was optimized by experiment of parameters matrix. The fabrication process of the stress-detecting section was also developed. Young's modulus of the PDMS thin film, which is the main part of the pressure sensor, was measured by using a nano-indenter.
AB - A novel highly sensitive pressure sensor was proposed in this paper. It has high flexibility (wearable) and modularization fabrication ability (high productivity and low cost). The proposed sensor structure was combined with two sections: a stress-concentration section and a stress-detecting section. The stress-concentration section has been successfully developed using PDMS patterned and copied from SU-8 micro structure, and the quality of the section was optimized by experiment of parameters matrix. The fabrication process of the stress-detecting section was also developed. Young's modulus of the PDMS thin film, which is the main part of the pressure sensor, was measured by using a nano-indenter.
UR - http://www.scopus.com/inward/record.url?scp=85045152212&partnerID=8YFLogxK
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U2 - 10.1109/IMPACT.2017.8255901
DO - 10.1109/IMPACT.2017.8255901
M3 - Conference contribution
AN - SCOPUS:85045152212
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 46
EP - 49
BT - IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PB - IEEE Computer Society
T2 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
Y2 - 25 October 2017 through 27 October 2017
ER -