TY - GEN
T1 - Hetero-integrated microsystem technology
AU - Tanaka, Shuji
AU - Esashi, Masayoshi
PY - 2011
Y1 - 2011
N2 - Hetero-integration defined in this paper is the wafer-level integration of MEMS and IC plus the use of functional materials. For this type of hetero-integration, there are technical problems in terms of allowable process temperature, thermal expansion mismatch, material-to-material process compatibility etc. New process technologies to overcome these problems and some hetero-integrated devices are described.
AB - Hetero-integration defined in this paper is the wafer-level integration of MEMS and IC plus the use of functional materials. For this type of hetero-integration, there are technical problems in terms of allowable process temperature, thermal expansion mismatch, material-to-material process compatibility etc. New process technologies to overcome these problems and some hetero-integrated devices are described.
UR - http://www.scopus.com/inward/record.url?scp=84870724753&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84870724753&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84870724753
SN - 9781622761906
T3 - Proceedings of the International Display Workshops
SP - 1219
EP - 1222
BT - Society for Information Display - 18th International Display Workshops 2011, IDW'11
T2 - 18th International Display Workshops 2011, IDW 2011
Y2 - 7 December 2011 through 9 December 2011
ER -
