TY - JOUR
T1 - Heterogeneous integration by adhesive bonding
AU - Esashi, Masayoshi
AU - Tanaka, Shuji
N1 - Publisher Copyright:
© 2013, Esashi and Tanaka; licensee Springer.
PY - 2013/12/1
Y1 - 2013/12/1
N2 - Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Films or MEMS devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to mirror array, resonator, piezoelectric switch, IR imager, tactile sensor, electron source and so on. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.
AB - Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Films or MEMS devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to mirror array, resonator, piezoelectric switch, IR imager, tactile sensor, electron source and so on. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.
KW - Adhesive bonding
KW - Heterogeneous integration
KW - Integrated MEMS
KW - Wafer level transfer
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U2 - 10.1186/2213-9621-1-3
DO - 10.1186/2213-9621-1-3
M3 - Review article
AN - SCOPUS:85035028856
SN - 2213-9621
VL - 1
JO - Micro and Nano Systems Letters
JF - Micro and Nano Systems Letters
IS - 1
M1 - 3
ER -