Heterogeneous integration by adhesive bonding

Masayoshi Esashi, Shuji Tanaka

Research output: Contribution to journalReview articlepeer-review

21 Citations (Scopus)


Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Films or MEMS devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to mirror array, resonator, piezoelectric switch, IR imager, tactile sensor, electron source and so on. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.

Original languageEnglish
Article number3
JournalMicro and Nano Systems Letters
Issue number1
Publication statusPublished - 2013 Dec 1


  • Adhesive bonding
  • Heterogeneous integration
  • Integrated MEMS
  • Wafer level transfer


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