Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor

Eiji Higurashi, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150°C. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm × 2.8 mm × 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.

Original languageEnglish
Title of host publicationISOT 2009 - International Symposium on Optomechatronic Technologies
Pages209-214
Number of pages6
DOIs
Publication statusPublished - 2009
EventISOT 2009 - International Symposium on Optomechatronic Technologies - Istanbul, Turkey
Duration: 2009 Sept 212009 Sept 23

Publication series

NameISOT 2009 - International Symposium on Optomechatronic Technologies

Conference

ConferenceISOT 2009 - International Symposium on Optomechatronic Technologies
Country/TerritoryTurkey
CityIstanbul
Period09/9/2109/9/23

Keywords

  • Displacement measurement
  • Grating interferometer
  • Heterogeneous integration
  • Low-temperature bonding
  • Microsensor

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