TY - GEN
T1 - Heterogeneously-integrated microdevices
AU - Tanaka, Shuji
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2017/1/31
Y1 - 2017/1/31
N2 - The integration of heterogeneous components or materials is a promising approach to create more functionalized, higher performance and smaller devices. However, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, significant efforts have been made in the world. This paper introduces two approaches by wafer bonding and film transfer, which have been developed in our group.
AB - The integration of heterogeneous components or materials is a promising approach to create more functionalized, higher performance and smaller devices. However, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, significant efforts have been made in the world. This paper introduces two approaches by wafer bonding and film transfer, which have been developed in our group.
UR - http://www.scopus.com/inward/record.url?scp=85014444688&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85014444688&partnerID=8YFLogxK
U2 - 10.1109/IEDM.2016.7838447
DO - 10.1109/IEDM.2016.7838447
M3 - Conference contribution
AN - SCOPUS:85014444688
T3 - Technical Digest - International Electron Devices Meeting, IEDM
SP - 18.5.1-18.5.4
BT - 2016 IEEE International Electron Devices Meeting, IEDM 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 62nd IEEE International Electron Devices Meeting, IEDM 2016
Y2 - 3 December 2016 through 7 December 2016
ER -