TY - GEN
T1 - High-bandwidth data transmission of new transceiver module through optical interconnection
AU - Ito, Yuka
AU - Terada, Shinsuke
AU - Arai, Shinya
AU - Choki, Koji
AU - Fukushima, Takafumi
AU - Koyangi, Mitsumasa
PY - 2011
Y1 - 2011
N2 - This paper presents optical interconnection for module-to-module length for high-performance computing system. A new multi-chip transceiver module consisting of optical components, IC chips, flexible printed circuits (FPCs), and a sheet of optical polynorbornene (PNB) waveguides was fabricated by simple packaging processes. Waveguide sheet with micromirrors and the FPCs mounting of O/E devices were completed independently. After that, the waveguide sheet was aligned to optical devices on FPCs passively. Optical loss for waveguide including propagation and micromirror couplings was 3.30 dB. We successfully demonstrate high-bandwidth 100-Gbps (12.5 Gbps/ch x 8 channels) data transmission with the module, on which two 4-channel vertical-cavity surface emitting laser (VCSEL) arrays, one VCSEL driver (VD), two 4-channel PD arrays, and one transimpedance amplifier/limiting amplifier (TIA/LA) were mounted.
AB - This paper presents optical interconnection for module-to-module length for high-performance computing system. A new multi-chip transceiver module consisting of optical components, IC chips, flexible printed circuits (FPCs), and a sheet of optical polynorbornene (PNB) waveguides was fabricated by simple packaging processes. Waveguide sheet with micromirrors and the FPCs mounting of O/E devices were completed independently. After that, the waveguide sheet was aligned to optical devices on FPCs passively. Optical loss for waveguide including propagation and micromirror couplings was 3.30 dB. We successfully demonstrate high-bandwidth 100-Gbps (12.5 Gbps/ch x 8 channels) data transmission with the module, on which two 4-channel vertical-cavity surface emitting laser (VCSEL) arrays, one VCSEL driver (VD), two 4-channel PD arrays, and one transimpedance amplifier/limiting amplifier (TIA/LA) were mounted.
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U2 - 10.1109/3DIC.2012.6263010
DO - 10.1109/3DIC.2012.6263010
M3 - Conference contribution
AN - SCOPUS:84866862186
SN - 9781467321891
T3 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
T2 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Y2 - 31 January 2012 through 2 February 2012
ER -