High Density Micro-Thermoelectric Generator Based on Electrodeposition of Bi2Te3and Sb2Te3

Chan Cheng Hou, Nguyen Van Toan, Takahito Ono

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This work reports a fabrication and evaluation of a high-density micro-thermoelectric generator (micro-TEG) based on electrodeposition of Bi2Te3 and Sb2Te3. The TEG consists of 240 pairs of thermoelectric elements with dimensions of 200 m x 200 m x 80 m, which is formed on a small footprint of 0.8937 cm2. An output voltage of the TEG reaches 20 mV under a temperature difference across the TEG of 1.5 °C. Moreover, energy harvesting from temperature fluctuations of the environment has been demonstrated. The proposed TEG with the high density shows a high potential to harvest from a small temperature difference at near room temperature as a power source for microdevices.

Original languageEnglish
Title of host publication35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
PublisherIEEE Computer Society
Pages600-603
Number of pages4
ISBN (Electronic)9781665409117
DOIs
Publication statusPublished - 2022
Event35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022 - Tokyo, Japan
Duration: 2022 Jan 92022 Jan 13

Publication series

NameIEEE Symposium on Mass Storage Systems and Technologies
Volume2022-January
ISSN (Print)2160-1968

Conference

Conference35th IEEE International Conference on Micro Electro Mechanical Systems Conference, MEMS 2022
Country/TerritoryJapan
CityTokyo
Period22/1/922/1/13

Keywords

  • BiTe
  • Micro-thermoelectric generator
  • SbTe
  • electrodeposition
  • energy harvesting
  • thick film

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'High Density Micro-Thermoelectric Generator Based on Electrodeposition of Bi2Te3and Sb2Te3'. Together they form a unique fingerprint.

Cite this