High frequency ultrasonic inspection of the bonded interface between a divertor monoblock and a cooling pipe

This study evaluated the applicability of a high-frequency ultrasonic test to the inspection of the bonded interfaces between a divertor monoblock and a cooling pipe. This study prepared a tungsten block bonded with 1 mm of oxygen-free copper and 1.5 mm-thick CuCrZr plates, which simplifies one of the fundamental designs of a divertor: a tungsten monoblock bonded with a cooling pipe with a copper interlayer. The samples were fabricated using a high-temperature vacuum furnace for diffusion bonding. A high-frequency ultrasonic immersion test using a 30 MHz probe was performed from the CuCrZr surface to simulate inspecting the interface from inside the pipe. Ultrasonic images obtained by the test were consistent with the actual bonding condition revealed by sectioning the samples; whether a flaw exists on the interface between CuCrZr and the oxygen-free copper or that between the oxygen-free copper and tungsten was clearly distinguished. The results of this study also suggested the possibility of detecting the growth of crystal grains caused by improper bonding such as too high bonding temperature.