TY - GEN
T1 - High quality graphene formation on 3C-SiC/4H-AIN/Si heterostructure
AU - Jiao, Sai
AU - Murakami, Yuya
AU - Nagasawa, Hiroyoki
AU - Fukidome, Hirokazu
AU - Makabe, Isao
AU - Tateno, Yasunori
AU - Nakabayashi, Takashi
AU - Suemitsu, Maki
N1 - Publisher Copyright:
© (2015) Trans Tech Publications, Switzerland.
PY - 2015
Y1 - 2015
N2 - The growth of graphene on 3C-SiC/Si heterostructure is a promising approach, which provides low production cost, high scalability and easiness of nano-electro-mechanical system fabrication. However, the quality of graphene is still insufficient for device applications due to mediocre morphological and structural quality of the 3C-SiC epilayers compared to bulk SiC crystals and to excessive Si out-diffusion from the Si substrate. Here, we propose a solution of inserting a 4H-A1N layer between 3C-SiC and Si, which allows us to polish the 3C-SiC film without enhancement of the Si out-diffusion despite the thinning of the 3C-SiC. With this insertion, a considerable quality improvement is achieved in our graphene-on-silicon.
AB - The growth of graphene on 3C-SiC/Si heterostructure is a promising approach, which provides low production cost, high scalability and easiness of nano-electro-mechanical system fabrication. However, the quality of graphene is still insufficient for device applications due to mediocre morphological and structural quality of the 3C-SiC epilayers compared to bulk SiC crystals and to excessive Si out-diffusion from the Si substrate. Here, we propose a solution of inserting a 4H-A1N layer between 3C-SiC and Si, which allows us to polish the 3C-SiC film without enhancement of the Si out-diffusion despite the thinning of the 3C-SiC. With this insertion, a considerable quality improvement is achieved in our graphene-on-silicon.
KW - 3C-SiC/4H-AIN/Si
KW - CMP
KW - Epitaxial Graphene
KW - Hydrogenation
KW - Raman
UR - http://www.scopus.com/inward/record.url?scp=84921442753&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84921442753&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/MSF.806.89
DO - 10.4028/www.scientific.net/MSF.806.89
M3 - Conference contribution
AN - SCOPUS:84921442753
T3 - Materials Science Forum
SP - 89
EP - 93
BT - HeteroSiC
A2 - Zielinski, Marcin
A2 - Zielinski, Marcin
PB - Trans Tech Publications Ltd
T2 - 2013 HeteroSiC-WASMPE Conference
Y2 - 17 June 2013 through 19 June 2013
ER -