TY - GEN
T1 - High resolution mapping of defects at SiO2/SiC interfaces by local-DLTS based on time-resolved scanning nonlinear dielectric microscopy
AU - Yamagishi, Yuji
AU - Cho, Yasuo
N1 - Funding Information:
This work was sponsored in part by a Grant-in-Aid for Scientific Research (16H06360) from the Japan Society for the Promotion of Science..
Publisher Copyright:
© 2019 IEEE.
PY - 2019/7
Y1 - 2019/7
N2 - High resolution observation of density of interface states (Hit) at SiO2/4H-SiC interfaces was performed by local deep level transient spectroscopy based on time-resolved scanning nonlinear dielectric microscopy (tr-SNDM). The sizes of the non-uniform contrasts observed in the map of Dit were in the order of several tens of nanometers, which are smaller than the value reported in the previous study (>100 nm). The simulation of the tr-SNDM measurement suggested that the spatial resolution of tr-SNDM is down to the tip radius of the cantilever used for the measurement and can be smaller than the lateral spread of the depletion layer width.
AB - High resolution observation of density of interface states (Hit) at SiO2/4H-SiC interfaces was performed by local deep level transient spectroscopy based on time-resolved scanning nonlinear dielectric microscopy (tr-SNDM). The sizes of the non-uniform contrasts observed in the map of Dit were in the order of several tens of nanometers, which are smaller than the value reported in the previous study (>100 nm). The simulation of the tr-SNDM measurement suggested that the spatial resolution of tr-SNDM is down to the tip radius of the cantilever used for the measurement and can be smaller than the lateral spread of the depletion layer width.
KW - Density of interface states
KW - Local deep level transient spectroscopy
KW - SiO/SiC MOS interface
KW - Time-resolved scanning nonlinear dielectric microscopy
UR - http://www.scopus.com/inward/record.url?scp=85082612982&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85082612982&partnerID=8YFLogxK
U2 - 10.1109/IPFA47161.2019.8984905
DO - 10.1109/IPFA47161.2019.8984905
M3 - Conference contribution
AN - SCOPUS:85082612982
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
BT - 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2019
Y2 - 2 July 2019 through 5 July 2019
ER -