@inproceedings{675be79bae314ea0a30c86442203d7d0,
title = "Highly thermoresistant temporary bonding/debonding system without organic adhesives for 3D integration",
abstract = "This study introduces a highly thermoresistant temporary bonding/debonding system. Known Good Dies (KGDs) were bonded through SOG to a support wafer. The KGDs were thinned, and Cu-TSVs were formed by via-last/backside-via processes. These KGDs can be readily debonded from the wafer by excimer laser irradiation to the a-Si:H layer on the wafer.",
author = "H. Hashiguchi and T. Fukushima and M. Murugesan and Bea, {J. C.} and H. Kino and Lee, {K. W.} and T. Tanaka and M. Koyanagi",
year = "2014",
doi = "10.1109/LTB-3D.2014.6886153",
language = "English",
isbn = "9781479952618",
series = "Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014",
publisher = "IEEE Computer Society",
pages = "14",
booktitle = "Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014",
address = "United States",
note = "2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 ; Conference date: 15-07-2014 Through 16-07-2014",
}