TY - JOUR
T1 - Hole tunnelling properties in resonant tunnelling diodes with Si/strained Si0.8Ge0.2 heterostructures grown on Si(1 0 0) by low-temperature ultraclean LPCVD
AU - Ito, Ryota
AU - Sakuraba, Masao
AU - Murota, Junichi
PY - 2007/1/1
Y1 - 2007/1/1
N2 - Hole resonant tunnelling diodes (RTDs) with Si/strained Si 1-xGex heterostructures epitaxially grown on Si(1 0 0) were fabricated, and sharp current peaks have been reproducibly observed. From the quantum well width dependence of the current-voltage characteristics, at the peak voltage, heavy holes in the accumulation region resonantly tunnel through the estimated resonant states of a light hole and a heavy hole in a Si1-xGex quantum well. The top contact and mesa area dependence of the peak current shows that the tunnel current only flows under a top contact electrode, i.e. the leakage current at the sidewall is negligibly small. The resonant tunnelling current density reaches as high as 3.6 kA cm-2 at 0.19 V with 2 nm thick barriers. Moreover, the introduction of higher Ge fraction effectively suppresses the increase of the valley current and enables negative differential conductance at higher operation temperature.
AB - Hole resonant tunnelling diodes (RTDs) with Si/strained Si 1-xGex heterostructures epitaxially grown on Si(1 0 0) were fabricated, and sharp current peaks have been reproducibly observed. From the quantum well width dependence of the current-voltage characteristics, at the peak voltage, heavy holes in the accumulation region resonantly tunnel through the estimated resonant states of a light hole and a heavy hole in a Si1-xGex quantum well. The top contact and mesa area dependence of the peak current shows that the tunnel current only flows under a top contact electrode, i.e. the leakage current at the sidewall is negligibly small. The resonant tunnelling current density reaches as high as 3.6 kA cm-2 at 0.19 V with 2 nm thick barriers. Moreover, the introduction of higher Ge fraction effectively suppresses the increase of the valley current and enables negative differential conductance at higher operation temperature.
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U2 - 10.1088/0268-1242/22/1/S09
DO - 10.1088/0268-1242/22/1/S09
M3 - Article
AN - SCOPUS:34247211058
SN - 0268-1242
VL - 22
SP - S38-S41
JO - Semiconductor Science and Technology
JF - Semiconductor Science and Technology
IS - 1
M1 - S09
ER -