Abstract
The authors have developed a holographic pattern measuring system (HPMS) which combines the techniques of holography and graphic image processing. The HPMS was applied to the study of the thermal deformation of a contact spring. Using this approach, the microscopic displacement of the contact spring could be quantitatively measured in a noncontact way, and the distribution of the displacement could be shown automatically as a three-dimensional graphic image. In the case of thermal excitation by the current flow through the electric contact, a quantitative correlation between the slide of the contact point and the thermal deformation of the contact spring was obtained. In addition, the authors found some irregularity in contact voltage when the current flowed through the closing contacts. From the deformation analysis of the contact spring, the relationship between the contact voltage and the deformation of the contact spring due to current flow was made clear.
| Original language | English |
|---|---|
| Pages (from-to) | 245-252 |
| Number of pages | 8 |
| Journal | Electrical Contacts, Proceedings of the Annual Holm Conference on Electrical Contacts |
| Publication status | Published - 1989 Sept |
| Externally published | Yes |
| Event | Proceedings of the Thirty Fifth Meeting of the IEEE Holm Conference on Electrical Contacts - Chicago, IL, USA Duration: 1989 Sept 18 → 1989 Sept 20 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering