HOLOGRAPHIC OBSERVATION OF DEFORMATION IN HEADER USED IN PLASTIC PACKAGE FOR HIGH OUTPUT POWER TRANSISTOR.

Nobuo Nishida; Hajime Suzuki; Kazuhiro Kosuge; Shoichi Koreeda; Seietsu Fukui

HOLOGRAPHIC OBSERVATION OF DEFORMATION IN HEADER USED IN PLASTIC PACKAGE FOR HIGH OUTPUT POWER TRANSISTOR.

Nobuo Nishida, Hajime Suzuki, Kazuhiro Kosuge, Shoichi Koreeda, Seietsu Fukui

Research output: Contribution to journal › Article › peer-review

Abstract

This paper reports a solution to the problem involving cracks in high power transistor chips that appeared during package development. Header deformation observation by holographic interferometry indicated the cause of the chip cracking. The observation method is described. The reason for chip cracks is discussed and the performance of headers fabricated in order to prevent chip cracks is discussed.

Original language	English
Pages (from-to)	33-41
Number of pages	9
Journal	NEC Research and Development
Issue number	46
Publication status	Published - 1977
Externally published	Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

@article{5ecd99c276594e76a2538d97293cd2db,

title = "HOLOGRAPHIC OBSERVATION OF DEFORMATION IN HEADER USED IN PLASTIC PACKAGE FOR HIGH OUTPUT POWER TRANSISTOR.",

abstract = "This paper reports a solution to the problem involving cracks in high power transistor chips that appeared during package development. Header deformation observation by holographic interferometry indicated the cause of the chip cracking. The observation method is described. The reason for chip cracks is discussed and the performance of headers fabricated in order to prevent chip cracks is discussed.",

author = "Nobuo Nishida and Hajime Suzuki and Kazuhiro Kosuge and Shoichi Koreeda and Seietsu Fukui",

year = "1977",

language = "English",

pages = "33--41",

journal = "NEC Research and Development",

issn = "0048-0436",

publisher = "NEC Media Products Ltd.",

number = "46",

}

TY - JOUR

T1 - HOLOGRAPHIC OBSERVATION OF DEFORMATION IN HEADER USED IN PLASTIC PACKAGE FOR HIGH OUTPUT POWER TRANSISTOR.

AU - Nishida, Nobuo

AU - Suzuki, Hajime

AU - Kosuge, Kazuhiro

AU - Koreeda, Shoichi

AU - Fukui, Seietsu

PY - 1977

Y1 - 1977

N2 - This paper reports a solution to the problem involving cracks in high power transistor chips that appeared during package development. Header deformation observation by holographic interferometry indicated the cause of the chip cracking. The observation method is described. The reason for chip cracks is discussed and the performance of headers fabricated in order to prevent chip cracks is discussed.

AB - This paper reports a solution to the problem involving cracks in high power transistor chips that appeared during package development. Header deformation observation by holographic interferometry indicated the cause of the chip cracking. The observation method is described. The reason for chip cracks is discussed and the performance of headers fabricated in order to prevent chip cracks is discussed.

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UR - http://www.scopus.com/inward/citedby.url?scp=0017515686&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:0017515686

SN - 0048-0436

SP - 33

EP - 41

JO - NEC Research and Development

JF - NEC Research and Development

IS - 46

ER -

HOLOGRAPHIC OBSERVATION OF DEFORMATION IN HEADER USED IN PLASTIC PACKAGE FOR HIGH OUTPUT POWER TRANSISTOR.

Abstract

ASJC Scopus subject areas

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