TY - JOUR
T1 - IC package and bonding wire modeling software and its application to RFIC design
AU - Goto, Kenji
AU - Dec, Aleksander
AU - Horio, Yoshihiko
AU - Suyama, Ken
AU - Akima, Hiroshi
PY - 2002
Y1 - 2002
N2 - This paper presents an IC package and bonding wire modeling software which generates an equivalent lumped circuit model from physical information of IC package and bonding wires. The resulting model takes into account the effects of frequency-dependent resistance, capacitance, as well as self and mutual inductance. The accuracy of the modeling approach has been verified using a 20-pin lead-less plastic chip carrier package. Furthermore, the application of the IC package characterization software to the design of a 700 MHz CMOS VCO has also been demonstrated.
AB - This paper presents an IC package and bonding wire modeling software which generates an equivalent lumped circuit model from physical information of IC package and bonding wires. The resulting model takes into account the effects of frequency-dependent resistance, capacitance, as well as self and mutual inductance. The accuracy of the modeling approach has been verified using a 20-pin lead-less plastic chip carrier package. Furthermore, the application of the IC package characterization software to the design of a 700 MHz CMOS VCO has also been demonstrated.
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U2 - 10.1109/MWSYM.2002.1012286
DO - 10.1109/MWSYM.2002.1012286
M3 - Article
AN - SCOPUS:0036063704
SN - 0149-645X
VL - 3
SP - 2109
EP - 2112
JO - IEEE MTT-S International Microwave Symposium Digest
JF - IEEE MTT-S International Microwave Symposium Digest
ER -