Impact of mechanical stress control on VLSI fabrication process

Shuji Ikeda, Yasuhide Hagiwara, Hideo Miura, Hiroyuki Ohta

Research output: Contribution to journalConference articlepeer-review

30 Citations (Scopus)


Fabrication process is designed to minimize mechanical stress in semiconductor devices and to improve device reliability. Mechanical stress levels were predicted by simulation then TEM analysis was performed to evaluate critical stress that generates dislocations. This gives us design guidelines for small geometry LOCOS process. Polysilicon thickness in the W polycide gate electrode is designed to minimize mechanical stress in the gate oxide and to suppress gate oxide failure in probe and class tests. Moreover, critical stress to generate dislocations during post source / drain ion implantation anneal is obtained by a ball indentation method. This indicated that lower temperature anneal is effective to suppress dislocations. Two-step anneal is introduced to suppress dislocations to enable higher ion activation.

Original languageEnglish
Pages (from-to)77-80
Number of pages4
JournalTechnical Digest - International Electron Devices Meeting
Publication statusPublished - 1996
EventProceedings of the 1996 IEEE International Electron Devices Meeting - San Francisco, CA, USA
Duration: 1996 Dec 81996 Dec 11


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