Abstract
To clarify the "epitaxial" formation process of TiN films due to nitrogen-implantation, changes of crystallographic structures of as-deposited Ti films during N-implantation were studied by using a transmission electron microscope (TEM). Analysis of the results of TEM observations indicated that H atoms which constituted TiHx were completely released from as-deposited Ti films when the films were heated up to 350 °C, and that the H-released unstable fcc-Ti sublattice was transformed into hcp-structure. Ions of N2+ with 62 keV were implanted into the hcp-Ti films held at 350 °C. In the N-implanted Ti film (N/Ti=0.954), there coexisted NaCl-type TiNy and a small amount of hcp-Ti. The (001)- and (110)-oriented TiNy were "epitaxially" formed by the transformation of (03·5)- and (2̄1·0)-oriented hcp-Ti, respectively. The lattice of N-implanted hcp-Ti was expanded by the occupation of octahedral sites by N atoms. Strain due to the lattice expansion was considered as a driving force for the hcp-fcc transformation of Ti sublattice.
Original language | English |
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Pages (from-to) | 175-179 |
Number of pages | 5 |
Journal | Thin Solid Films |
Volume | 464-465 |
DOIs | |
Publication status | Published - 2004 Oct |
Keywords
- Fcc-hcp transformation
- In-situ TEM
- Ion-implantation
- TiN
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Metals and Alloys
- Materials Chemistry