Abstract
In the present letter we compare the thermal conductivities of Cu- and Ni-based alloys in relation with their cooling rates and glass-forming abilities. The cooling rates obtained for Cu- and Ni-based bulk glass-forming alloys arc found to scale with the thermal conductivities of the base elements. Relatively low thermal conductivity of Ni-based alloy compared to the Cu-based one explains its lower glass-forming ability. The results also indicate that the thermal conductivity of the molten alloy should be also used as an indicator of the glass-forming ability among the other factors.
Original language | English |
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Article number | 251902 |
Journal | Applied Physics Letters |
Volume | 88 |
Issue number | 25 |
DOIs | |
Publication status | Published - 2006 Jun 19 |