Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool

Taichi Saito; Kazunori Takahashi; Akira Ando; Shiro Hara

doi:10.1109/ISSM.2018.8651176

Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool

Taichi Saito, Kazunori Takahashi, Akira Ando, Shiro Hara

ENG - Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A minimal multi-target helicon sputtering tool has been developed for depositing a multi-layer metallic film in Minimal Fab System. In sputtering processes, high energy charged particles and recoil neutrals often flow into the substrate, resulting in an increase in a substrate temperature. Here the substrate temperature is investigated in a laboratory prototype of the minimal multi-target sputtering tool. Our experiment shows that the increase in the temperature can be successfully inhibited by installing a magnetic filter. This result implies that the increase in the substrate temperature is induced by secondary electrons from the target surface.

Original language	English
Title of host publication	2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781538662687
DOIs	https://doi.org/10.1109/ISSM.2018.8651176
Publication status	Published - 2019 Feb 22
Event	2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Tokyo, Japan Duration: 2018 Dec 10 → 2018 Dec 11

Publication series

Name	IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
Volume	2018-December
ISSN (Print)	1523-553X

Conference

Conference	2018 International Symposium on Semiconductor Manufacturing, ISSM 2018
Country/Territory	Japan
City	Tokyo
Period	18/12/10 → 18/12/11

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Engineering(all)
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/ISSM.2018.8651176

Cite this

Saito, T., Takahashi, K., Ando, A., & Hara, S. (2019). Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool. In 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings [8651176] (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings; Vol. 2018-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISSM.2018.8651176

Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool. / Saito, Taichi; Takahashi, Kazunori ; Ando, Akira et al.
2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8651176 (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings; Vol. 2018-December).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Saito, T, Takahashi, K , Ando, A & Hara, S 2019, Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool. in 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings., 8651176, IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings, vol. 2018-December, Institute of Electrical and Electronics Engineers Inc., 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018, Tokyo, Japan, 18/12/10. https://doi.org/10.1109/ISSM.2018.8651176

Saito T, Takahashi K , Ando A, Hara S. Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool. In 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. 8651176. (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings). doi: 10.1109/ISSM.2018.8651176

Saito, Taichi ; Takahashi, Kazunori ; Ando, Akira et al. / Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool. 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. (IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings).

@inproceedings{94bbf71658d7475f8d5a7605c8edca76,

title = "Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool",

abstract = "A minimal multi-target helicon sputtering tool has been developed for depositing a multi-layer metallic film in Minimal Fab System. In sputtering processes, high energy charged particles and recoil neutrals often flow into the substrate, resulting in an increase in a substrate temperature. Here the substrate temperature is investigated in a laboratory prototype of the minimal multi-target sputtering tool. Our experiment shows that the increase in the temperature can be successfully inhibited by installing a magnetic filter. This result implies that the increase in the substrate temperature is induced by secondary electrons from the target surface.",

author = "Taichi Saito and Kazunori Takahashi and Akira Ando and Shiro Hara",

year = "2019",

month = feb,

day = "22",

doi = "10.1109/ISSM.2018.8651176",

language = "English",

series = "IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings",

note = "2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 ; Conference date: 10-12-2018 Through 11-12-2018",

}

TY - GEN

T1 - Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool

AU - Saito, Taichi

AU - Takahashi, Kazunori

AU - Ando, Akira

AU - Hara, Shiro

PY - 2019/2/22

Y1 - 2019/2/22

N2 - A minimal multi-target helicon sputtering tool has been developed for depositing a multi-layer metallic film in Minimal Fab System. In sputtering processes, high energy charged particles and recoil neutrals often flow into the substrate, resulting in an increase in a substrate temperature. Here the substrate temperature is investigated in a laboratory prototype of the minimal multi-target sputtering tool. Our experiment shows that the increase in the temperature can be successfully inhibited by installing a magnetic filter. This result implies that the increase in the substrate temperature is induced by secondary electrons from the target surface.

AB - A minimal multi-target helicon sputtering tool has been developed for depositing a multi-layer metallic film in Minimal Fab System. In sputtering processes, high energy charged particles and recoil neutrals often flow into the substrate, resulting in an increase in a substrate temperature. Here the substrate temperature is investigated in a laboratory prototype of the minimal multi-target sputtering tool. Our experiment shows that the increase in the temperature can be successfully inhibited by installing a magnetic filter. This result implies that the increase in the substrate temperature is induced by secondary electrons from the target surface.

UR - http://www.scopus.com/inward/record.url?scp=85063203925&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85063203925&partnerID=8YFLogxK

U2 - 10.1109/ISSM.2018.8651176

DO - 10.1109/ISSM.2018.8651176

M3 - Conference contribution

AN - SCOPUS:85063203925

T3 - IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

BT - 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2018 International Symposium on Semiconductor Manufacturing, ISSM 2018

Y2 - 10 December 2018 through 11 December 2018

ER -

Inhibitation of substrate heating in a minimal multi-target helicon sputtering tool

Abstract

Publication series

Conference

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this