TY - GEN
T1 - Integrated MEMS by adhesive bonding
AU - Esashi, Masayoshi
AU - Tanaka, Shuji
PY - 2013
Y1 - 2013
N2 - Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. MEMS devices of films formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to resonator, piezoelectric switch, tactile sensor, electron source. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.
AB - Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. MEMS devices of films formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. Film transfer processes and device transfer processes have been developed and applied to resonator, piezoelectric switch, tactile sensor, electron source. Selective bonding to transfer devices on one carrier wafer to multiple LSI wafers has been developed.
UR - http://www.scopus.com/inward/record.url?scp=84893959659&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893959659&partnerID=8YFLogxK
U2 - 10.1109/ICSENS.2013.6688122
DO - 10.1109/ICSENS.2013.6688122
M3 - Conference contribution
AN - SCOPUS:84893959659
SN - 9781467346405
T3 - Proceedings of IEEE Sensors
BT - IEEE SENSORS 2013 - Proceedings
PB - IEEE Computer Society
T2 - 12th IEEE SENSORS 2013 Conference
Y2 - 4 November 2013 through 6 November 2013
ER -