Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing

Takafumi Fukushima; Shinichi Sakuyama; Masatomo Takahashi; Hiroyuki Hashimoto; Jichoel Bea; Theodorus Marcello; Hisashi Kino; Tetsu Tanaka; Mitsumasa Koyanagi; Murugesan Mariappan

doi:10.1109/3DIC52383.2021.9687601

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing

Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Murugesan Mariappan

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper describes nano-scale probe integration on a printed circuit board (PCB) using electroless TSV formation technology for achieving small scrub marks when testing solder microbumps formed on LSI wafers. The nanoprobes are resulted from the backside grinding and dry etching of Si substrates in which an array of Ni/Cu-TSVs with a tip diameter of 500 nm are fabricated. The TSV nanoprobes are also transferred to the PCB before the Si etch step. We demonstrate the probe contact to a thin solder layer for testing wafer-level packages with fine-pitch microbumps. In addition, the nanoprobes are electrically and mechanically characterized in this study.

Original language	English
Title of host publication	IEEE International 3D System Integration Conference, 3DIC 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781665417068
DOIs	https://doi.org/10.1109/3DIC52383.2021.9687601
Publication status	Published - 2021
Event	2021 IEEE International 3D System Integration Conference, 3DIC 2021 - Virtual, Raleigh, United States Duration: 2021 Nov 15 → 2021 Nov 18

Publication series

Name	IEEE International 3D System Integration Conference, 3DIC 2021

Conference

Conference	2021 IEEE International 3D System Integration Conference, 3DIC 2021
Country/Territory	United States
City	Virtual, Raleigh
Period	21/11/15 → 21/11/18

Keywords

nano-TSV
nanoprobes
probe cards
water testing

ASJC Scopus subject areas

Fluid Flow and Transfer Processes
Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/3DIC52383.2021.9687601

Cite this

Fukushima, T., Sakuyama, S., Takahashi, M., Hashimoto, H., Bea, J., Marcello, T., Kino, H., Tanaka, T., Koyanagi, M., & Mariappan, M. (2021). Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. In IEEE International 3D System Integration Conference, 3DIC 2021 (IEEE International 3D System Integration Conference, 3DIC 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DIC52383.2021.9687601

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. / Fukushima, Takafumi; Sakuyama, Shinichi; Takahashi, Masatomo et al.
IEEE International 3D System Integration Conference, 3DIC 2021. Institute of Electrical and Electronics Engineers Inc., 2021. (IEEE International 3D System Integration Conference, 3DIC 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Fukushima, T, Sakuyama, S, Takahashi, M, Hashimoto, H, Bea, J, Marcello, T, Kino, H , Tanaka, T, Koyanagi, M & Mariappan, M 2021, Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. in IEEE International 3D System Integration Conference, 3DIC 2021. IEEE International 3D System Integration Conference, 3DIC 2021, Institute of Electrical and Electronics Engineers Inc., 2021 IEEE International 3D System Integration Conference, 3DIC 2021, Virtual, Raleigh, United States, 21/11/15. https://doi.org/10.1109/3DIC52383.2021.9687601

Fukushima T, Sakuyama S, Takahashi M, Hashimoto H, Bea J, Marcello T et al. Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. In IEEE International 3D System Integration Conference, 3DIC 2021. Institute of Electrical and Electronics Engineers Inc. 2021. (IEEE International 3D System Integration Conference, 3DIC 2021). doi: 10.1109/3DIC52383.2021.9687601

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title = "Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing",

abstract = "This paper describes nano-scale probe integration on a printed circuit board (PCB) using electroless TSV formation technology for achieving small scrub marks when testing solder microbumps formed on LSI wafers. The nanoprobes are resulted from the backside grinding and dry etching of Si substrates in which an array of Ni/Cu-TSVs with a tip diameter of 500 nm are fabricated. The TSV nanoprobes are also transferred to the PCB before the Si etch step. We demonstrate the probe contact to a thin solder layer for testing wafer-level packages with fine-pitch microbumps. In addition, the nanoprobes are electrically and mechanically characterized in this study. ",

keywords = "nano-TSV, nanoprobes, probe cards, water testing",

author = "Takafumi Fukushima and Shinichi Sakuyama and Masatomo Takahashi and Hiroyuki Hashimoto and Jichoel Bea and Theodorus Marcello and Hisashi Kino and Tetsu Tanaka and Mitsumasa Koyanagi and Murugesan Mariappan",

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doi = "10.1109/3DIC52383.2021.9687601",

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AB - This paper describes nano-scale probe integration on a printed circuit board (PCB) using electroless TSV formation technology for achieving small scrub marks when testing solder microbumps formed on LSI wafers. The nanoprobes are resulted from the backside grinding and dry etching of Si substrates in which an array of Ni/Cu-TSVs with a tip diameter of 500 nm are fabricated. The TSV nanoprobes are also transferred to the PCB before the Si etch step. We demonstrate the probe contact to a thin solder layer for testing wafer-level packages with fine-pitch microbumps. In addition, the nanoprobes are electrically and mechanically characterized in this study.

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Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing

Abstract

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Keywords

ASJC Scopus subject areas

Access to Document

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