TY - GEN
T1 - Integration of diamond microelectrodes on CMOS-based amperometric biosensor array by film transfer technology
AU - Hayasaka, Takeshi
AU - Yoshida, Shinya
AU - Inoue, Kumi Y.
AU - Nakano, Masanori
AU - Ishikawa, Tomohiro
AU - Matsue, Tomokazu
AU - Esashi, Masayoshi
AU - Tanaka, Shuji
PY - 2014
Y1 - 2014
N2 - This paper reports a complementary metal oxide semiconductor (CMOS)-based 20×20 amperometric biosensor array using boron-doped diamond (BDD) microelectrodes with excellent electrochemical properties. The BDD electrodes were once formed on a Si wafer at 800°C, and then transferred to a 0.18 μm CMOS wafer with a benzocyclobutene (BCB) bonding interlayer. As a result, the BDD microelectrodes were arrayed without damage in the CMOS LSI circuit. The fully-integrated device could detect histamine and dopamine owing to a wide potential window of the BDD electrode, and offered 2-dimensional real-time imaging of histamine diffusion in a solution.
AB - This paper reports a complementary metal oxide semiconductor (CMOS)-based 20×20 amperometric biosensor array using boron-doped diamond (BDD) microelectrodes with excellent electrochemical properties. The BDD electrodes were once formed on a Si wafer at 800°C, and then transferred to a 0.18 μm CMOS wafer with a benzocyclobutene (BCB) bonding interlayer. As a result, the BDD microelectrodes were arrayed without damage in the CMOS LSI circuit. The fully-integrated device could detect histamine and dopamine owing to a wide potential window of the BDD electrode, and offered 2-dimensional real-time imaging of histamine diffusion in a solution.
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U2 - 10.1109/MEMSYS.2014.6765641
DO - 10.1109/MEMSYS.2014.6765641
M3 - Conference contribution
AN - SCOPUS:84898954812
SN - 9781479935086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 322
EP - 325
BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Y2 - 26 January 2014 through 30 January 2014
ER -