TY - JOUR
T1 - Interfacial reaction between Zn-Al-based high-temperature solders and Ni substrate
AU - Takaku, Yoshikazu
AU - Makino, Komei
AU - Watanabe, Keita
AU - Ohnuma, Ikuo
AU - Kainuma, Ryosuke
AU - Yamada, Yasushi
AU - Yagi, Yuji
AU - Nakagawa, Ikuo
AU - Atsumi, Takashi
AU - Ishida, Kiyohito
N1 - Funding Information:
Support from CREST, the Japan Science and Technology Agency, and NEDO (The New Energy and Industrial Technology Development Organization) are acknowledged. One of authors (R.K.) acknowledges support of an ISIJ Research Promotion Grant from the Iron and Steel Institute of Japan.
PY - 2009/1
Y1 - 2009/1
N2 - The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped with an inverter system as well as a heat engine. In this study, the interfacial reaction between Zn-Al(-Cu) alloys and the Ni substrate during soldering, aging, and thermal cycling was investigated. Semiconductor chips and Ni substrates were soldered with Zn-Al(-Cu) alloys at various temperatures under a nitrogen atmosphere. The soldered assemblies were then heat-treated at 200°C and 300°C to examine the microstructural evolution at the soldered interface. The effect of severe thermal cycles between -40°C and 250°C in air on the microstructure and fracture behavior at the solder joint was investigated. Even after a 1000-cycle test, the thickness of the Al 3Ni 2 layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of the soldered assemblies, was quite small.
AB - The Zn-Al(-Cu) eutectic alloys (melting point 381°C) are candidates for use as Pb-free high-temperature solders as a substitute for Pb-based solders, which are suitable for severe working environments such as the engine room of hybrid vehicles equipped with an inverter system as well as a heat engine. In this study, the interfacial reaction between Zn-Al(-Cu) alloys and the Ni substrate during soldering, aging, and thermal cycling was investigated. Semiconductor chips and Ni substrates were soldered with Zn-Al(-Cu) alloys at various temperatures under a nitrogen atmosphere. The soldered assemblies were then heat-treated at 200°C and 300°C to examine the microstructural evolution at the soldered interface. The effect of severe thermal cycles between -40°C and 250°C in air on the microstructure and fracture behavior at the solder joint was investigated. Even after a 1000-cycle test, the thickness of the Al 3Ni 2 layer formed at the interface between the Zn-Al-based solder and the Ni substrate, which is responsible for the damage of the soldered assemblies, was quite small.
KW - Interfacial reaction
KW - Intermetallic compound
KW - Ni substrate
KW - Thermal cycling test
KW - Zn-Al-Cu solder
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U2 - 10.1007/s11664-008-0528-y
DO - 10.1007/s11664-008-0528-y
M3 - Article
AN - SCOPUS:57649225488
SN - 0361-5235
VL - 38
SP - 54
EP - 60
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 1
ER -