@inproceedings{81b3ff0f28334d8aacea976150cdd1dc,
title = "Intermetallic Compounds for Interconnect Metal beyond 3 nm Node",
abstract = "We report the recent results of NiAl and CuAl2 intermetallic compounds for advanced-node interconnect materials in place of Cu. Reported results of Co and Ru are briefly reviewed for comparison. CuAl2 can be a good choice in terms of liner-free and barrier-free interconnections having a low resistivity and a good TDDB and EM reliability.",
keywords = "CuAl2, NiAl, interconnect, intermetallic",
author = "Junichi Koike and Toshihito Kuge and Linghan Chen and Masataka Yahagi",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 24th Annual IEEE International Interconnect Technology Conference, IITC 2021 ; Conference date: 06-07-2021 Through 09-07-2021",
year = "2021",
month = jul,
day = "6",
doi = "10.1109/IITC51362.2021.9537364",
language = "English",
series = "2021 IEEE International Interconnect Technology Conference, IITC 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 IEEE International Interconnect Technology Conference, IITC 2021",
}