Interpack welcome

Roger Schmidt, Hideo Miura, Jeffrey C. Suhling

Research output: Contribution to journal › Editorial

Original language	English
Pages (from-to)	iii
Journal	2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume	1
Publication status	Published - 2007
Event	ASME Electronic and Photonics Packaging Division - Vancouver, BC, United States Duration: 2007 Jul 8 → 2007 Jul 12

Cite this

@article{66d1825ed174457c865dbb5ca2e23c50,

title = "Interpack welcome",

author = "Roger Schmidt and Hideo Miura and Suhling, {Jeffrey C.}",

year = "2007",

language = "English",

volume = "1",

pages = "iii",

journal = "2007 Proceedings of the ASME InterPack Conference, IPACK 2007",

note = "ASME Electronic and Photonics Packaging Division ; Conference date: 08-07-2007 Through 12-07-2007",

}

TY - JOUR

T1 - Interpack welcome

AU - Schmidt, Roger

AU - Miura, Hideo

AU - Suhling, Jeffrey C.

PY - 2007

Y1 - 2007

UR - http://www.scopus.com/inward/record.url?scp=40449134124&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=40449134124&partnerID=8YFLogxK

M3 - Editorial

AN - SCOPUS:40449134124

VL - 1

SP - iii

JO - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007

JF - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007

T2 - ASME Electronic and Photonics Packaging Division

Y2 - 8 July 2007 through 12 July 2007

ER -