An inverted microstrip line IC structure for ultra high-speed applications is proposed. It allows a very low-parasitic-impedance module with a flip-chip bonding, a small IC size, and performance improvements for high-speed digital ICs.
|Number of pages||4|
|Journal||IEEE MTT-S International Microwave Symposium Digest|
|Publication status||Published - 1995|
|Event||Proceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA|
Duration: 1995 May 16 → 1995 May 20