Abstract
High power and high reliable IGBTs are used in applications to tractions and high voltage converters. We have investigated a flat-pack IGBT, compared with an IGBT module and a GTO, to realize the ruggedness in electrical, thermal and mechanical stresses, and the long term reliability. The thermo-mechanical behaviors on the Si chip surface are discussed, on two-dimensional numerical simulation results and power cycling test results.
| Original language | English |
|---|---|
| Pages (from-to) | 1016-1021 |
| Number of pages | 6 |
| Journal | Conference Record - IAS Annual Meeting (IEEE Industry Applications Society) |
| Volume | 2 |
| Publication status | Published - 1998 Dec 1 |
| Externally published | Yes |
| Event | Proceedings of the 1998 IEEE Industry Applications Conference. Part 1 (of 3) - St.Louis, MO, USA Duration: 1998 Oct 12 → 1998 Oct 15 |
ASJC Scopus subject areas
- Control and Systems Engineering
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering