TY - GEN
T1 - Investigation of specimen- and grain-size dependence of yield stress in electrodeposited nanocrystalline copper through micropillar compression
AU - Okamoto, Norihiko L.
AU - Kashioka, Daisuke
AU - Inui, Haruyuki
N1 - Copyright:
Copyright 2014 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - The specimen-size dependence of yield stress of nanocrystalline copper with average grain size (d) of 360 nm has been investigated through uniaxial compression tests of micrometer-size pillars fabricated via the focused ion beam method. The yield stress decreases with the decrease in the micropillar size while the yield stress is almost constant for larger micropillars. The critical specimen size (t) is approximately 12.5 μm, correspoinding to the critical (t/d) value, (t/d)*, of 35, which is much larger than that for coarse-grained copper polycrystals.
AB - The specimen-size dependence of yield stress of nanocrystalline copper with average grain size (d) of 360 nm has been investigated through uniaxial compression tests of micrometer-size pillars fabricated via the focused ion beam method. The yield stress decreases with the decrease in the micropillar size while the yield stress is almost constant for larger micropillars. The critical specimen size (t) is approximately 12.5 μm, correspoinding to the critical (t/d) value, (t/d)*, of 35, which is much larger than that for coarse-grained copper polycrystals.
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U2 - 10.1557/opl.2013.559
DO - 10.1557/opl.2013.559
M3 - Conference contribution
AN - SCOPUS:84899734478
SN - 9781632661067
T3 - Materials Research Society Symposium Proceedings
SP - 18
EP - 23
BT - Mechanical Behavior of Metallic Nanostructured Materials
PB - Materials Research Society
T2 - 2012 MRS Fall Meeting
Y2 - 25 November 2012 through 30 November 2012
ER -