Abstract
Effect of W and TiN/W gate metal on the interface quality of La 2O3/InGaAs metal-oxide-semiconductor (MOS) interface is investigated. Hard X-ray photoelectron spectroscopy revealed that gate metal greatly affects the oxidation states at La2O3/InGaAs interface after post-metallization annealing (PMA). Results demonstrate that TiN/W gate metal can effectively control the reaction at La2O 3/InGaAs interface and also suppress the formation of As, Ga, and In oxides. As a result, superior capacitance-voltage (C-V) characteristics with low interface state density (Dit) of 4.6 × 1011 cm -2/eV (∼0.1 eV from midgap) and leakage current below 10 -5 A/cm2 was obtained for TiN/W/La2O 3 (10 nm)/InGaAs MOS capacitors. The MOS structure integrity was preserved for annealing temperature up to 620 °C.
Original language | English |
---|---|
Pages (from-to) | 29-33 |
Number of pages | 5 |
Journal | Solid-State Electronics |
Volume | 82 |
DOIs | |
Publication status | Published - 2013 |
Externally published | Yes |
Keywords
- Capacitor
- High-k/InGaAs
- Interface reaction
- Interface state density
- LaO
- Metal gate
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry