TY - JOUR
T1 - Life Estimation for IC Plastic Packages Under Temperature Cycling Based on Fracture Mechanics
AU - Nishimura, Asao
AU - Tatemichi, Akihiro
AU - Miura, Hideo
AU - Sakamoto, Tatsuji
PY - 1987/12
Y1 - 1987/12
N2 - The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.
AB - The strength of plastic encapsulants is analyzed from the viewpoint of crack propagation. With a preexisting crack length a and a specific number of applied load cycles N, fatigue crack propagation rates da/dN of the encapsulants were measured with laboratory test specimens. It was found that the da/dN of encapsulants can be expressed as functions of the stress intensity factor range ΔK. The crack propagation behavior in the package was estimated from the data of da/dN and ΔK at the lowest temperature of the test cycles. Reasonable correlation is found between the estimated crack propagation behavior and the observed one. The applicability of fracture mechanics to the package cracking problem is demonstrated.
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U2 - 10.1109/TCHMT.1987.1134777
DO - 10.1109/TCHMT.1987.1134777
M3 - Article
AN - SCOPUS:0023560046
SN - 0148-6411
VL - 10
SP - 637
EP - 642
JO - IEEE Transactions on Components, Hybrids and Manufacturing Technology
JF - IEEE Transactions on Components, Hybrids and Manufacturing Technology
IS - 4
ER -