TY - JOUR
T1 - Low contact resistivity with low silicide/p+-Silicon schottky barrier for high-performance p-channel metal-oxide-silicon field effect transistors
AU - Tanaka, Hiroaki
AU - Isogai, Tatsunori
AU - Goto, Tetsuya
AU - Teramoto, Akinobu
AU - Sugawa, Shigetoshi
AU - Ohmi, Tadahiro
PY - 2010/4
Y1 - 2010/4
N2 - A current drivability improvement of p-channel metal-oxide-silicon field effect transistors (MOSFETs) is necessary for the performance enhancement of complementary metal-oxide-semiconductor (CMOS) circuits. In this paper, we present the key technology for fabricating indispensable CMOS circuits with a small Schottky barrier height and a low contact resistance for p-type silicon using Pd2Si. We fabricated a Pd2Si gate Schottky barrier diode and a Kelvin pattern on silicon. The measured Schottky barrier height is 0.29 eV for p-type silicon. We also realized a very low contact resistivity of 3:7 × 10-9Ωcm2 for the pp region of silicon. The p-channel MOSFET with Pd2Si source/drain contacts realized a good characteristic, that is, a small off current. The technology developed in this work involves silicide formation for source/drain contacts of p-channel MOSFETs, which is expected to realize the performance enhancement of MOSFETs.
AB - A current drivability improvement of p-channel metal-oxide-silicon field effect transistors (MOSFETs) is necessary for the performance enhancement of complementary metal-oxide-semiconductor (CMOS) circuits. In this paper, we present the key technology for fabricating indispensable CMOS circuits with a small Schottky barrier height and a low contact resistance for p-type silicon using Pd2Si. We fabricated a Pd2Si gate Schottky barrier diode and a Kelvin pattern on silicon. The measured Schottky barrier height is 0.29 eV for p-type silicon. We also realized a very low contact resistivity of 3:7 × 10-9Ωcm2 for the pp region of silicon. The p-channel MOSFET with Pd2Si source/drain contacts realized a good characteristic, that is, a small off current. The technology developed in this work involves silicide formation for source/drain contacts of p-channel MOSFETs, which is expected to realize the performance enhancement of MOSFETs.
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U2 - 10.1143/JJAP.49.04DA03
DO - 10.1143/JJAP.49.04DA03
M3 - Article
AN - SCOPUS:77952721704
SN - 0021-4922
VL - 49
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
IS - 4 PART 2
M1 - 04DA03
ER -