Low-energy focused-ion-beam shape observation and its noise reduction for nanofabrication

M. Itoh, Y. Hirayama, S. Tarucha

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


Two types of noise from the variable landing-energy focused-ion-beam (FIB) system appeared when FIB was line-scanned on an n-GaAs wafer and implantation-induced damage was estimated by using selective etching and secondary electron microscope (SEM) observation. The first had a rough surface with small craters away from implanted lines and the second had clearly observable scratchiness along implanted lines. Cathode luminescence measurement and auger analysis were performed to estimate beam-tail spreading. Both the long-beam-tail and the scratchy noise probably originated from unintentionally scattered beams in the ion-beam lens column and/or neutral particles emitted from the liquid metal ion source. As a result, these noises could be greatly reduced by locating a new aperture at an appropriate position. Using this refined FIB system, low landing-energy-ion-beams should be able to be applied to fabricate high-quality mesoscopic devices.

Original languageEnglish
Pages (from-to)21-34
Number of pages14
JournalMicroelectronic Engineering
Issue number1
Publication statusPublished - 1998 Feb 1


  • Aperture
  • FIB
  • Implantation-induced damage
  • Lens column
  • Mesoscopic devices
  • Noise


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