TY - GEN
T1 - Low temperature bonding of bulk metallic glass using an ultrasonic process
AU - Nishikawa, Hiroshi
AU - Piromsarn, Krit Wong
AU - Abe, Hiroya
AU - Takemoto, Tadashi
AU - Kubo, Masao
AU - Sanagawa, Yoshiharu
AU - Sakai, Takamasa
AU - Fukuhara, Mikio
AU - Inoue, Akihisa
PY - 2010
Y1 - 2010
N2 - For bulk metallic glasses (BMGs) to be adopted over a broader range of engineering applications, it is imperative to develop appropriate bonding processes for BMG/BMG and BMG/crystalline metal. The glass transition temperature and crystallization temperature of BMGs are relatively low. Therefore, to avoid the recrystallization of the glassy phase during bonding, low-temperature processes such as common soldering and ultrasonic wedge bonding process have been studied. The purpose of this study is to determine the feasibility of ultrasonic A1 wire wedge bonding on Cu-, Ni-, and Zr-based BMGs. We achieved the bonding of A1 wire to BMGs at ambient temperatures, and it was found that the interfaces are straight and sharp without any visible intermetallic compound layers under conventional magnifications of a scanning electron microscope.
AB - For bulk metallic glasses (BMGs) to be adopted over a broader range of engineering applications, it is imperative to develop appropriate bonding processes for BMG/BMG and BMG/crystalline metal. The glass transition temperature and crystallization temperature of BMGs are relatively low. Therefore, to avoid the recrystallization of the glassy phase during bonding, low-temperature processes such as common soldering and ultrasonic wedge bonding process have been studied. The purpose of this study is to determine the feasibility of ultrasonic A1 wire wedge bonding on Cu-, Ni-, and Zr-based BMGs. We achieved the bonding of A1 wire to BMGs at ambient temperatures, and it was found that the interfaces are straight and sharp without any visible intermetallic compound layers under conventional magnifications of a scanning electron microscope.
UR - http://www.scopus.com/inward/record.url?scp=77956043641&partnerID=8YFLogxK
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U2 - 10.1002/9780470917145.ch5
DO - 10.1002/9780470917145.ch5
M3 - Conference contribution
AN - SCOPUS:77956043641
SN - 9780470909171
T3 - Ceramic Transactions
SP - 29
EP - 35
BT - Characterization and Control of Interfaces for High Quality Advanced Materials III - Proc. 3rd Int. Conf. on Characterization and Control of Interfaces for High Quality Advanced Materials,ICCCI2009
PB - American Ceramic Society
T2 - 3rd International Conference on Characterization and Control of Interfaces for High Quality Advanced Materials, ICCCI2009
Y2 - 6 September 2009 through 9 September 2009
ER -