TY - GEN
T1 - Low temperature direct bonding of flip-chip mounting VCSEL to Si substrate
AU - Imamura, T.
AU - Higurashi, E.
AU - Suga, T.
AU - Sawada, R.
PY - 2006
Y1 - 2006
N2 - This paper describes the result of low temperature direct metal bonding of vertical-cavity surface-emitting laser (VCSEL) for flip-chip mounting to Si substrate by surface activated bonding (SAB) method. In the SAB process, radio frequency (RF) driven, low-pressure argon (Ar) plasma was used to clean the surfaces to be bonded. After organic contaminants on the surfaces of Au electrodes of the VCSEL and Si substrate were removed by Ar RF plasma, Au-Au direct bonding was carried out in the ambient air. The high die-shear strength of 84 MPa (77.4 gf) was achieved at a bonding temperature of 150°C. Therefore, Au SAB bonding in the ambient air can be applied to realize low cost and highly functional optical microsystems.
AB - This paper describes the result of low temperature direct metal bonding of vertical-cavity surface-emitting laser (VCSEL) for flip-chip mounting to Si substrate by surface activated bonding (SAB) method. In the SAB process, radio frequency (RF) driven, low-pressure argon (Ar) plasma was used to clean the surfaces to be bonded. After organic contaminants on the surfaces of Au electrodes of the VCSEL and Si substrate were removed by Ar RF plasma, Au-Au direct bonding was carried out in the ambient air. The high die-shear strength of 84 MPa (77.4 gf) was achieved at a bonding temperature of 150°C. Therefore, Au SAB bonding in the ambient air can be applied to realize low cost and highly functional optical microsystems.
KW - Flip-chip bonding
KW - Hybrid integration
KW - Surface activated bonding
KW - VCSEL
UR - http://www.scopus.com/inward/record.url?scp=46249100118&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=46249100118&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2006.312175
DO - 10.1109/IMPACT.2006.312175
M3 - Conference contribution
AN - SCOPUS:46249100118
SN - 1424407354
SN - 9781424407354
T3 - 2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers
SP - 185
EP - 188
BT - 2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers
T2 - 2006 International Microsystems, Packaging, Assembly Conference Taiwan, IMPACT
Y2 - 18 October 2006 through 20 October 2006
ER -