Low-voltage PZT-actuated MEMS switch monolithically integrated with CMOS circuit

Matsuo Kousuke, Masaaki Moriyama, Masayoshi Esashi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

23 Citations (Scopus)

Abstract

MEMS switches actuated by PZT at low voltage were integrated with 0.35 μm CMOS. A preliminary test confirmed that the switch and the CMOS circuit worked well. PZT must be deposited at high temperature, and thus not CMOS-compatible. To overcome this limitation, we fabricated switch structures on a Si dummy wafer using PZT sol-gel method, and then transferred them to the CMOS wafer by polymer bonding. After the dummy wafer was removed, the switch structure and the CMOS circuit were connected by Au electroplating. Finally, the polymer was sacrificially etched by O 2 plasma to release the switches.

Original languageEnglish
Title of host publication2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Pages1153-1156
Number of pages4
DOIs
Publication statusPublished - 2012
Event2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012 - Paris, France
Duration: 2012 Jan 292012 Feb 2

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Conference

Conference2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Country/TerritoryFrance
CityParis
Period12/1/2912/2/2

Fingerprint

Dive into the research topics of 'Low-voltage PZT-actuated MEMS switch monolithically integrated with CMOS circuit'. Together they form a unique fingerprint.

Cite this