TY - GEN
T1 - Low-voltage PZT-actuated MEMS switch monolithically integrated with CMOS circuit
AU - Kousuke, Matsuo
AU - Moriyama, Masaaki
AU - Esashi, Masayoshi
AU - Tanaka, Shuji
PY - 2012
Y1 - 2012
N2 - MEMS switches actuated by PZT at low voltage were integrated with 0.35 μm CMOS. A preliminary test confirmed that the switch and the CMOS circuit worked well. PZT must be deposited at high temperature, and thus not CMOS-compatible. To overcome this limitation, we fabricated switch structures on a Si dummy wafer using PZT sol-gel method, and then transferred them to the CMOS wafer by polymer bonding. After the dummy wafer was removed, the switch structure and the CMOS circuit were connected by Au electroplating. Finally, the polymer was sacrificially etched by O 2 plasma to release the switches.
AB - MEMS switches actuated by PZT at low voltage were integrated with 0.35 μm CMOS. A preliminary test confirmed that the switch and the CMOS circuit worked well. PZT must be deposited at high temperature, and thus not CMOS-compatible. To overcome this limitation, we fabricated switch structures on a Si dummy wafer using PZT sol-gel method, and then transferred them to the CMOS wafer by polymer bonding. After the dummy wafer was removed, the switch structure and the CMOS circuit were connected by Au electroplating. Finally, the polymer was sacrificially etched by O 2 plasma to release the switches.
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U2 - 10.1109/MEMSYS.2012.6170367
DO - 10.1109/MEMSYS.2012.6170367
M3 - Conference contribution
AN - SCOPUS:84860490312
SN - 9781467303248
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1153
EP - 1156
BT - 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
T2 - 2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012
Y2 - 29 January 2012 through 2 February 2012
ER -