TY - GEN
T1 - Lowest variability SOI FinFETs having multiple Vt by back-biasing
AU - Matsukawa, T.
AU - Fukuda, K.
AU - Liu, Y. X.
AU - Endo, K.
AU - Tsukada, J.
AU - Yamauchi, H.
AU - Ishikawa, Y.
AU - O'Uchi, S.
AU - Mizubayashi, W.
AU - Migita, S.
AU - Morita, Y.
AU - Ota, H.
AU - Masahara, M.
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/9/8
Y1 - 2014/9/8
N2 - FinFETs with an amorphous metal gate (MG) are fabricated on silicon-on-thin-buried-oxide (SOTB) wafers for realizing both low variability and tunable threshold voltage (Vt) necessary for multiple Vt solution. The FinFETs with an amorphous TaSiN MG record the lowest on-state drain current (Ion) variability (0.37 %μm) in comparison to bulk and SOI planar MOSFETs thanks to the suppressed variability of Vt (AVt=1.32 mVμm), drain induced barrier lowering (DIBL) and trans-conductance (Gm). Back-biasing through the SOTB provides excellent Vt controllability keeping the low Vt variability in contrast to Vt tuning by fin channel doping.
AB - FinFETs with an amorphous metal gate (MG) are fabricated on silicon-on-thin-buried-oxide (SOTB) wafers for realizing both low variability and tunable threshold voltage (Vt) necessary for multiple Vt solution. The FinFETs with an amorphous TaSiN MG record the lowest on-state drain current (Ion) variability (0.37 %μm) in comparison to bulk and SOI planar MOSFETs thanks to the suppressed variability of Vt (AVt=1.32 mVμm), drain induced barrier lowering (DIBL) and trans-conductance (Gm). Back-biasing through the SOTB provides excellent Vt controllability keeping the low Vt variability in contrast to Vt tuning by fin channel doping.
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U2 - 10.1109/VLSIT.2014.6894393
DO - 10.1109/VLSIT.2014.6894393
M3 - Conference contribution
AN - SCOPUS:84907703488
T3 - Digest of Technical Papers - Symposium on VLSI Technology
BT - Digest of Technical Papers - Symposium on VLSI Technology
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 34th Symposium on VLSI Technology, VLSIT 2014
Y2 - 9 June 2014 through 12 June 2014
ER -