TY - GEN
T1 - MADO interface
T2 - 3rd International Conference on Tangible and Embedded Interaction, TEI'09
AU - Maekawa, Takuya
AU - Itoh, Yuichi
AU - Kawai, Norifumi
AU - Kitamura, Yoshifumi
AU - Kishino, Fumio
PY - 2009
Y1 - 2009
N2 - "MADO Interface" is a tangible user interface consisting of a compact touch-screen display and physical blocks. "MADO" means "window" in Japanese, and MADO Interface is utilized as the real window into the virtual world. Users construct a physical object by simply combining electrical blocks. Then, by connecting MADO Interface to the physical object, they can watch the virtual model corresponding to the physical block configuration (shape, color, etc.) The size and the viewpoint of the virtual model seen by the user depend on the position of MADO Interface, maintaining the consistency between the physical and virtual worlds. In addition, users can interact with the virtual model by touching the display on MADO Interface. These features enable users to explore the virtual world intuitively and powerfully.
AB - "MADO Interface" is a tangible user interface consisting of a compact touch-screen display and physical blocks. "MADO" means "window" in Japanese, and MADO Interface is utilized as the real window into the virtual world. Users construct a physical object by simply combining electrical blocks. Then, by connecting MADO Interface to the physical object, they can watch the virtual model corresponding to the physical block configuration (shape, color, etc.) The size and the viewpoint of the virtual model seen by the user depend on the position of MADO Interface, maintaining the consistency between the physical and virtual worlds. In addition, users can interact with the virtual model by touching the display on MADO Interface. These features enable users to explore the virtual world intuitively and powerfully.
KW - 3D modeling
KW - Bi-directional interface
KW - MADO Interface
KW - Mixed reality
KW - Real-time interaction
KW - Tangible user interface
UR - http://www.scopus.com/inward/record.url?scp=70349102406&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=70349102406&partnerID=8YFLogxK
U2 - 10.1145/1517664.1517704
DO - 10.1145/1517664.1517704
M3 - Conference contribution
AN - SCOPUS:70349102406
SN - 9781605584935
T3 - Proceedings of the 3rd International Conference on Tangible and Embedded Interaction, TEI'09
SP - 175
EP - 180
BT - Proceedings of the 3rd International Conference on Tangible and Embedded Interaction, TEI'09
Y2 - 16 February 2009 through 18 February 2009
ER -