Magnetic nanoferrites for RF CMOS: Enabling 5G and beyond

Ranajit Sai; S. A. Shivashankar; Masahiro Yamaguchi; Navakanta Bhat

doi:10.1149/2.F08174if

Magnetic nanoferrites for RF CMOS: Enabling 5G and beyond

Ranajit Sai, S. A. Shivashankar, Masahiro Yamaguchi, Navakanta Bhat

New Industry Creation Hatchery Center (NICHe)

Research output: Contribution to journal › Article › peer-review

15 Citations (Scopus)

Abstract

This article focuses on two of the proposed frequency bands, centered around 6 GHz and 28 GHz, which are designated for connected vehicles and indoor hotspot applications. Demanding KPIs of various applications call for innovation in radio frequency integrated circuit (RFIC) design. Printing/pasting a composite layer of pre-processed ferrite powder in a polymer matrix can be a low-temperature CMOS-compatible process for 5G communication technology. The technological shift towards higher frequency for the looming 5G systems brings countless challenges, providing boundless opportunities to innovate, so as to meet the demanding specifications of high frequency integrated circuits. Development of CMOS-compatible low-temperature deposition of ferrite films and the integration of such a deposition method into the semiconductor processing technology is the immediate necessity to address these challenges.

Original language	English
Pages (from-to)	71-76
Number of pages	6
Journal	Electrochemical Society Interface
Volume	26
Issue number	4
DOIs	https://doi.org/10.1149/2.F08174if
Publication status	Published - 2017

Access to Document

10.1149/2.F08174if

Cite this

@article{01fd0dd9a4dd45ac9e1cbf976ee9bc01,

title = "Magnetic nanoferrites for RF CMOS: Enabling 5G and beyond",

abstract = "This article focuses on two of the proposed frequency bands, centered around 6 GHz and 28 GHz, which are designated for connected vehicles and indoor hotspot applications. Demanding KPIs of various applications call for innovation in radio frequency integrated circuit (RFIC) design. Printing/pasting a composite layer of pre-processed ferrite powder in a polymer matrix can be a low-temperature CMOS-compatible process for 5G communication technology. The technological shift towards higher frequency for the looming 5G systems brings countless challenges, providing boundless opportunities to innovate, so as to meet the demanding specifications of high frequency integrated circuits. Development of CMOS-compatible low-temperature deposition of ferrite films and the integration of such a deposition method into the semiconductor processing technology is the immediate necessity to address these challenges.",

author = "Ranajit Sai and Shivashankar, {S. A.} and Masahiro Yamaguchi and Navakanta Bhat",

note = "Funding Information: The authors acknowledge funding support from the Ministry of Electronics and Information Technology and the Department of Science and Technology, Government of India. The authors also acknowledge the support received from The Ministry of Internal Affairs and Communications (MIC), Government of Japan, for the project Development of Technical Examination Services Concerning Frequency Crowding, and Japan Society for the Promotion of Science for granting a DST-JSPS joint bilateral research project.",

year = "2017",

doi = "10.1149/2.F08174if",

language = "English",

volume = "26",

pages = "71--76",

journal = "Electrochemical Society Interface",

issn = "1064-8208",

publisher = "Institute of Physics Publishing",

number = "4",

}

TY - JOUR

T1 - Magnetic nanoferrites for RF CMOS

T2 - Enabling 5G and beyond

AU - Sai, Ranajit

AU - Shivashankar, S. A.

AU - Yamaguchi, Masahiro

AU - Bhat, Navakanta

N1 - Funding Information: The authors acknowledge funding support from the Ministry of Electronics and Information Technology and the Department of Science and Technology, Government of India. The authors also acknowledge the support received from The Ministry of Internal Affairs and Communications (MIC), Government of Japan, for the project Development of Technical Examination Services Concerning Frequency Crowding, and Japan Society for the Promotion of Science for granting a DST-JSPS joint bilateral research project.

PY - 2017

Y1 - 2017

N2 - This article focuses on two of the proposed frequency bands, centered around 6 GHz and 28 GHz, which are designated for connected vehicles and indoor hotspot applications. Demanding KPIs of various applications call for innovation in radio frequency integrated circuit (RFIC) design. Printing/pasting a composite layer of pre-processed ferrite powder in a polymer matrix can be a low-temperature CMOS-compatible process for 5G communication technology. The technological shift towards higher frequency for the looming 5G systems brings countless challenges, providing boundless opportunities to innovate, so as to meet the demanding specifications of high frequency integrated circuits. Development of CMOS-compatible low-temperature deposition of ferrite films and the integration of such a deposition method into the semiconductor processing technology is the immediate necessity to address these challenges.

AB - This article focuses on two of the proposed frequency bands, centered around 6 GHz and 28 GHz, which are designated for connected vehicles and indoor hotspot applications. Demanding KPIs of various applications call for innovation in radio frequency integrated circuit (RFIC) design. Printing/pasting a composite layer of pre-processed ferrite powder in a polymer matrix can be a low-temperature CMOS-compatible process for 5G communication technology. The technological shift towards higher frequency for the looming 5G systems brings countless challenges, providing boundless opportunities to innovate, so as to meet the demanding specifications of high frequency integrated circuits. Development of CMOS-compatible low-temperature deposition of ferrite films and the integration of such a deposition method into the semiconductor processing technology is the immediate necessity to address these challenges.

UR - http://www.scopus.com/inward/record.url?scp=85044156564&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85044156564&partnerID=8YFLogxK

U2 - 10.1149/2.F08174if

DO - 10.1149/2.F08174if

M3 - Article

AN - SCOPUS:85044156564

SN - 1064-8208

VL - 26

SP - 71

EP - 76

JO - Electrochemical Society Interface

JF - Electrochemical Society Interface

IS - 4

ER -

Magnetic nanoferrites for RF CMOS: Enabling 5G and beyond

Abstract

Access to Document

Other files and links

Fingerprint

Cite this