@inproceedings{936b01fb59dc47fcbcfc4f7e8f6080be,
title = "Measurements and simulation of substrate noise coupling in RF ICs with CMOS digital noise emulator",
abstract = "Substrate noise coupling in RF receiver front end circuitry for LTE wireless communication was examined by full-chip level simulation and on-chip measurements, with a demonstrator built in a 65 nm CMOS technology. A complete simulation flow of full-chip level substrate noise coupling uses a decoupled modeling approach, where substrate noise waveforms drawn with a unified package-chip model of noise source circuits are given to mixed-level simulation of RF chains as noise sensitive circuits. The distribution of substrate noise in a chip and the attenuation with distance are simulated and compare with the measurements. The interference of substrate noise at the 17th harmonics of 124.8 MHz - the operating frequency of the CMOS noise emulator creates spurious tones in the communication bandwidth at 2.1 GHz.",
keywords = "Noise interference, Power delivery network, Substrate coupling, Wireless communication",
author = "N. Azuma and S. Shimazaki and N. Miura and M. Nagata and T. Kitamura and S. Takahashi and M. Murakami and K. Hori and A. Nakamura and K. Tsukamoto and M. Iwanami and E. Hankui and S. Muroga and Y. Endo and S. Tanaka and M. Yamaguchi",
year = "2013",
doi = "10.1109/EMCCompo.2013.6735170",
language = "English",
isbn = "9781479923151",
series = "EMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits",
publisher = "IEEE Computer Society",
pages = "42--46",
booktitle = "EMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits",
address = "United States",
note = "9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2013 ; Conference date: 15-12-2013 Through 18-12-2013",
}