TY - GEN
T1 - Mechanical and electrical reliability of copper interconnections for 3DIC
AU - Saito, Naoki
AU - Murata, Naokazu
AU - Tamakawa, Kinji
AU - Suzuki, Ken
AU - Miura, Hideo
PY - 2011
Y1 - 2011
N2 - The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.
AB - The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.
UR - http://www.scopus.com/inward/record.url?scp=84866858208&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84866858208&partnerID=8YFLogxK
U2 - 10.1109/3DIC.2012.6262998
DO - 10.1109/3DIC.2012.6262998
M3 - Conference contribution
AN - SCOPUS:84866858208
SN - 9781467321891
T3 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
T2 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Y2 - 31 January 2012 through 2 February 2012
ER -