TY - GEN
T1 - Mechanism of resistivity decrease in networked-nanographite wires for multi-layer graphene interconnects
AU - Sato, Motonobu
AU - Ogawa, Shuichi
AU - Inukai, Manabu
AU - Ikenaga, Eiji
AU - Muro, Takayuki
AU - Takakuwa, Yuji
AU - Nihei, Mizuhisa
AU - Yokoyama, Naoki
PY - 2011
Y1 - 2011
N2 - We investigated the mechanism of resistivity decrease in networked-nanographite wires. The wires had no failure during over 200 hours under a current density of 5E5A/cm2 at about 400C. However, their resistivity decreased gradually owing to thermal stress. Raman and x-ray photoelectron spectroscopy revealed that the decrease in resistivity can be attributed to an increase in sp2 bonding corresponding to the formation of a graphene sheet. It is important to clarify the mechanism for the decrease in resistivity, not only to improve thermal stability but also to obtain lower resistivity in carbon interconnects.
AB - We investigated the mechanism of resistivity decrease in networked-nanographite wires. The wires had no failure during over 200 hours under a current density of 5E5A/cm2 at about 400C. However, their resistivity decreased gradually owing to thermal stress. Raman and x-ray photoelectron spectroscopy revealed that the decrease in resistivity can be attributed to an increase in sp2 bonding corresponding to the formation of a graphene sheet. It is important to clarify the mechanism for the decrease in resistivity, not only to improve thermal stability but also to obtain lower resistivity in carbon interconnects.
UR - http://www.scopus.com/inward/record.url?scp=80052040191&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=80052040191&partnerID=8YFLogxK
U2 - 10.1109/IITC.2011.5940268
DO - 10.1109/IITC.2011.5940268
M3 - Conference contribution
AN - SCOPUS:80052040191
SN - 9781457705038
T3 - 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011
BT - 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011
T2 - 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IITC/MAM 2011
Y2 - 8 May 2011 through 12 May 2011
ER -