MEMS-CMOS integrated tactile sensor with digital signal processing for robot application

M. Makihata; Masanori Muroyama; S. Tanaka; H. Yamada; T. Nakayama; U. Yamaguchi; K. Mima; Y. Nonomura; M. Fujiyoshi; Masayoshi Esashi

doi:10.1557/opl.2012.1489

MEMS-CMOS integrated tactile sensor with digital signal processing for robot application

M. Makihata, Masanori Muroyama, S. Tanaka, H. Yamada, T. Nakayama, U. Yamaguchi, K. Mima, Y. Nonomura, M. Fujiyoshi, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

An ultra-small tactile sensor with functions of signal processing and digital communication has been prototyped based on MEMS-CMOS integration technology. The designed analog-digital mixed signal ASIC allows many tactile sensors to connect each other on a common bus line, which drastically reduces the number of wire. The ASIC capacitively detects the deformation of a force sensor and sends digital data to the common bus line when the force exceeds a threshold. The digital data contain a physical ID of each sensor, 32-bit sensing data and 16-bit cyclic redundancy check (CRC) code. In this study, a novel wafer-level integration and packaging technology were developed, and a chip-size-packaged tactile sensor with a small footprint (2.5mmx2.5mm) and a low profile (0.27mm) was prototyped and tested. The sensor autonomously sends digital data like a tactile receptor of human.

Original language	English
Title of host publication	Heterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI
Pages	98-105
Number of pages	8
DOIs	https://doi.org/10.1557/opl.2012.1489
Publication status	Published - 2012
Event	2012 MRS Spring Meeting - San Francisco, CA, United States Duration: 2012 Apr 9 → 2012 Apr 13

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	1427
ISSN (Print)	0272-9172

Other

Other	2012 MRS Spring Meeting
Country/Territory	United States
City	San Francisco, CA
Period	12/4/9 → 12/4/13

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1557/opl.2012.1489

Cite this

Makihata, M., Muroyama, M., Tanaka, S., Yamada, H., Nakayama, T., Yamaguchi, U., Mima, K., Nonomura, Y., Fujiyoshi, M., & Esashi, M. (2012). MEMS-CMOS integrated tactile sensor with digital signal processing for robot application. In Heterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI (pp. 98-105). (Materials Research Society Symposium Proceedings; Vol. 1427). https://doi.org/10.1557/opl.2012.1489

MEMS-CMOS integrated tactile sensor with digital signal processing for robot application. / Makihata, M.; Muroyama, Masanori; Tanaka, S. et al.
Heterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI. 2012. p. 98-105 (Materials Research Society Symposium Proceedings; Vol. 1427).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Makihata, M, Muroyama, M, Tanaka, S, Yamada, H, Nakayama, T, Yamaguchi, U, Mima, K, Nonomura, Y, Fujiyoshi, M & Esashi, M 2012, MEMS-CMOS integrated tactile sensor with digital signal processing for robot application. in Heterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI. Materials Research Society Symposium Proceedings, vol. 1427, pp. 98-105, 2012 MRS Spring Meeting, San Francisco, CA, United States, 12/4/9. https://doi.org/10.1557/opl.2012.1489

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MEMS-CMOS integrated tactile sensor with digital signal processing for robot application

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