MEMS on LSI

M. Esashi; S. Tanaka

doi:10.1149/1.3568875

MEMS on LSI

M. Esashi, S. Tanaka

ENG - Robotics

Tohoku University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

Original language	English
Title of host publication	Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
Publisher	Electrochemical Society Inc.
Pages	319-330
Number of pages	12
Edition	2
ISBN (Electronic)	9781607682134
ISBN (Print)	9781566778633
DOIs	https://doi.org/10.1149/1.3568875
Publication status	Published - 2011

Publication series

Name	ECS Transactions
Number	2
Volume	35
ISSN (Print)	1938-5862
ISSN (Electronic)	1938-6737

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10.1149/1.3568875

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title = "MEMS on LSI",

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AB - Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

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ER -

MEMS on LSI

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