Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.