MEMS on LSI by adhesive bonding and wafer level packaging

Masayoshi Esashi; Shuji Tanaka

doi:10.1557/opl.2012.1402

MEMS on LSI by adhesive bonding and wafer level packaging

Masayoshi Esashi, Shuji Tanaka

ENG - Robotics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Resonators and switches are fabricated on LSI for advance wireless communication systems. In addition to surface micromachining, adhesive bonding has been applied for the fabrication. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromachining. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer (wafer bonding first approach). SAW filters are made by bonding a MEMS wafer to a LSI wafer (wafer bonding last approach). Variable capacitors are fabricated on a piezoelectric LiNbO₃ wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared wafer, prototyping facility and hands-on access fabrication facility are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

Original language	English
Title of host publication	Heterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI
Pages	38-49
Number of pages	12
DOIs	https://doi.org/10.1557/opl.2012.1402
Publication status	Published - 2012
Event	2012 MRS Spring Meeting - San Francisco, CA, United States Duration: 2012 Apr 9 → 2012 Apr 13

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	1427
ISSN (Print)	0272-9172

Other

Other	2012 MRS Spring Meeting
Country/Territory	United States
City	San Francisco, CA
Period	12/4/9 → 12/4/13

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1557/opl.2012.1402

Cite this

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title = "MEMS on LSI by adhesive bonding and wafer level packaging",

abstract = "Resonators and switches are fabricated on LSI for advance wireless communication systems. In addition to surface micromachining, adhesive bonding has been applied for the fabrication. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromachining. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer (wafer bonding first approach). SAW filters are made by bonding a MEMS wafer to a LSI wafer (wafer bonding last approach). Variable capacitors are fabricated on a piezoelectric LiNbO3 wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared wafer, prototyping facility and hands-on access fabrication facility are discussed to reduce a cost and a risk in the development of the MEMS on LSI.",

author = "Masayoshi Esashi and Shuji Tanaka",

year = "2012",

doi = "10.1557/opl.2012.1402",

language = "English",

isbn = "9781627482363",

series = "Materials Research Society Symposium Proceedings",

pages = "38--49",

booktitle = "Heterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI",

note = "2012 MRS Spring Meeting ; Conference date: 09-04-2012 Through 13-04-2012",

}

TY - GEN

T1 - MEMS on LSI by adhesive bonding and wafer level packaging

AU - Esashi, Masayoshi

AU - Tanaka, Shuji

PY - 2012

Y1 - 2012

N2 - Resonators and switches are fabricated on LSI for advance wireless communication systems. In addition to surface micromachining, adhesive bonding has been applied for the fabrication. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromachining. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer (wafer bonding first approach). SAW filters are made by bonding a MEMS wafer to a LSI wafer (wafer bonding last approach). Variable capacitors are fabricated on a piezoelectric LiNbO3 wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared wafer, prototyping facility and hands-on access fabrication facility are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

AB - Resonators and switches are fabricated on LSI for advance wireless communication systems. In addition to surface micromachining, adhesive bonding has been applied for the fabrication. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromachining. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer (wafer bonding first approach). SAW filters are made by bonding a MEMS wafer to a LSI wafer (wafer bonding last approach). Variable capacitors are fabricated on a piezoelectric LiNbO3 wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared wafer, prototyping facility and hands-on access fabrication facility are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

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U2 - 10.1557/opl.2012.1402

DO - 10.1557/opl.2012.1402

M3 - Conference contribution

AN - SCOPUS:84879265767

SN - 9781627482363

T3 - Materials Research Society Symposium Proceedings

SP - 38

EP - 49

BT - Heterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI

T2 - 2012 MRS Spring Meeting

Y2 - 9 April 2012 through 13 April 2012

ER -

MEMS on LSI by adhesive bonding and wafer level packaging

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