Abstract
A micro-assembly technique for microstructures using a silicon clip mechanism is developed for a time-of-flight scanning force microscope (TOF-SFM) probe with an electrostatically driven actuator. Microsprings formed by deep reactive-ion etching are used for the clip micromechanism. Cantilever-shaped microelements for the TOF-SFM are handled by a manipulator, and the microgap between the microspring and opposite wall is expanded by pulling the microspring using a microneedle. Then, the microelement is inserted into the micromechanism, and is clipped by releasing the microspring. After assembly, all microelements are fixed with a conductive glue. Electrostatic actuation of the cantilevered microelement is demonstrated. This technique is advantageous in the fabrication of complex three-dimensional microstructures.
Original language | English |
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Pages (from-to) | 98-102 |
Number of pages | 5 |
Journal | IEEJ Transactions on Sensors and Micromachines |
Volume | 135 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2015 Mar 1 |
Keywords
- Electrostatic actuator
- Micro-assembly
- Micromechanism
- Scanning force microscopy