Micro-encoder using image obtained by ball lens assembled inside wafer

Minoru Sasaki; Fuki Nakai; Kazuhiro Hane; Kanji Yokomizo; Kazuhito Hori

doi:10.1109/OMEMS.2005.1540110

Micro-encoder using image obtained by ball lens assembled inside wafer

Minoru Sasaki, Fuki Nakai, Kazuhiro Hane, Kanji Yokomizo, Kazuhito Hori

ENG - Finemechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An absolute micro-encoder based on the code imaging is developed. The ball lens (φ300 μm) is assembled inside the cavity between the pyrex glass lid and suspensions in the handling Si layer of the SOI wafer. The photodiode array is prepared in the device Si layer. The image of the scale is incident on the backside of the photodiodes. The electrical wiring to photodiodes does not disturb the optics. The current signal shows the sufficient contrast for resolving the maximum length code having the minimum line width of 13.6 μm.

Original language	English
Title of host publication	IEEE/LEOS Optical MEMS 2005
Subtitle of host publication	International Conference on Optical MEMS and Their Applications
Pages	125-126
Number of pages	2
DOIs	https://doi.org/10.1109/OMEMS.2005.1540110
Publication status	Published - 2005 Dec 1
Event	IEEE/LEOS Optical MEMS 2005: International Conference on Optical MEMS and Their Applications - Oulu, Finland Duration: 2005 Aug 1 → 2005 Aug 4

Other

Other	IEEE/LEOS Optical MEMS 2005: International Conference on Optical MEMS and Their Applications
Country/Territory	Finland
City	Oulu
Period	05/8/1 → 05/8/4

Keywords

Ball lens
Code imaging
Maximum length code
Micro-encoder

ASJC Scopus subject areas

Engineering(all)

Access to Document

10.1109/OMEMS.2005.1540110

Cite this

Sasaki, M, Nakai, F, Hane, K, Yokomizo, K & Hori, K 2005, Micro-encoder using image obtained by ball lens assembled inside wafer. in IEEE/LEOS Optical MEMS 2005: International Conference on Optical MEMS and Their Applications., 1540110, pp. 125-126, IEEE/LEOS Optical MEMS 2005: International Conference on Optical MEMS and Their Applications, Oulu, Finland, 05/8/1. https://doi.org/10.1109/OMEMS.2005.1540110

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title = "Micro-encoder using image obtained by ball lens assembled inside wafer",

abstract = "An absolute micro-encoder based on the code imaging is developed. The ball lens (φ300 μm) is assembled inside the cavity between the pyrex glass lid and suspensions in the handling Si layer of the SOI wafer. The photodiode array is prepared in the device Si layer. The image of the scale is incident on the backside of the photodiodes. The electrical wiring to photodiodes does not disturb the optics. The current signal shows the sufficient contrast for resolving the maximum length code having the minimum line width of 13.6 μm.",

keywords = "Ball lens, Code imaging, Maximum length code, Micro-encoder",

author = "Minoru Sasaki and Fuki Nakai and Kazuhiro Hane and Kanji Yokomizo and Kazuhito Hori",

year = "2005",

month = dec,

day = "1",

doi = "10.1109/OMEMS.2005.1540110",

language = "English",

isbn = "0780392787",

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T1 - Micro-encoder using image obtained by ball lens assembled inside wafer

AU - Sasaki, Minoru

AU - Nakai, Fuki

AU - Hane, Kazuhiro

AU - Yokomizo, Kanji

AU - Hori, Kazuhito

PY - 2005/12/1

Y1 - 2005/12/1

N2 - An absolute micro-encoder based on the code imaging is developed. The ball lens (φ300 μm) is assembled inside the cavity between the pyrex glass lid and suspensions in the handling Si layer of the SOI wafer. The photodiode array is prepared in the device Si layer. The image of the scale is incident on the backside of the photodiodes. The electrical wiring to photodiodes does not disturb the optics. The current signal shows the sufficient contrast for resolving the maximum length code having the minimum line width of 13.6 μm.

AB - An absolute micro-encoder based on the code imaging is developed. The ball lens (φ300 μm) is assembled inside the cavity between the pyrex glass lid and suspensions in the handling Si layer of the SOI wafer. The photodiode array is prepared in the device Si layer. The image of the scale is incident on the backside of the photodiodes. The electrical wiring to photodiodes does not disturb the optics. The current signal shows the sufficient contrast for resolving the maximum length code having the minimum line width of 13.6 μm.

KW - Ball lens

KW - Code imaging

KW - Maximum length code

KW - Micro-encoder

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M3 - Conference contribution

AN - SCOPUS:33749074284

SN - 0780392787

SN - 9780780392786

SP - 125

EP - 126

BT - IEEE/LEOS Optical MEMS 2005

T2 - IEEE/LEOS Optical MEMS 2005: International Conference on Optical MEMS and Their Applications

Y2 - 1 August 2005 through 4 August 2005

ER -

Micro-encoder using image obtained by ball lens assembled inside wafer

Abstract

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Keywords

ASJC Scopus subject areas

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